Dongguan City Xingle Electronic Insulation Material Co., Ltd.
thickness 0.0125-0.25mm polyimide high temperature imine PI film KAPTON
thickness 0.0125-0.25mm polyimide high temperature imine PI film KAPTON
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Flexible Printed Circuit Board (FPCB)
Driven by higher processing requirements, the growing number of functionalities and the trend for thinner design, FPCB has been
replacing RPCB (Rigid Printed Circuit Board) rapidly due to its thin and flexible features. PI Advanced Materials’ Polyimide film
for FCCL (Flexible Copper Clad Laminate), coverlay and substrate in FPCB lays the foundation for flexible and compact integrated
circuits in smart devices to enable high performance in a compact design.
|
item |
value |
|
Place of Origin |
China |
|
Model Number |
6052 |
|
Type |
Insulation Film |
|
Material |
polyimide film |
|
Application |
High Voltage |
|
Rated Voltage |
220V |
|
Tensile Strength |
165Mpa |
|
Color |
Yellow |
|
Size |
Customized Size |
|
Thickness |
0.0125---0.25mm |
|
Width |
8----1040mm |
|
MOQ |
5KG |
|
Density |
1.45g/cm3 |
|
Sample |
Freely Supplied |
|
Usage |
Electrical Insulation Protection |
|
Operating temperature |
-270-+450C |
|
Package |
Standard Package |
